AI matchmaking event in Xiamen highlights latest industry breakthroughs

Participants try out the latest AI products at the booths of leading companies. [Photo provided to chinadaily.com.cn]

The AI Terminal Device Industry Chain Matchmaking Event was held on Nov 25 in Xiamen, bringing together leading companies such as ZTE, Honor, and Oppo, along with research institutes.

The event sought to strengthen connections across innovation, industrial and supply chains, accelerate the commercialization of AI technologies, and foster an ecosystem in which large, medium and small enterprises grow in synergy.

In the AI glasses exhibition area, Yan Xiaotian, director of the National Virtual Reality Innovation Center (Qingdao), said that AI glasses are shifting from a mere concept to mass production. Breakthroughs in key technologies such as waveguides and Micro-LEDs are on the way, turning traditional wearable devices into more powerful intelligent assistants.

At the matchmaking site, companies showcased their latest innovations. Rockchip Electronics Co Ltd reduced chip response latency to 0.1 seconds, enabling smoother interaction. Yealink Network Technology Co Ltd brought a conferencing system that can intelligently capture speakers for more efficient remote collaboration.

Zhu Chencai, general manager of Honor PC product line, shares his insights on AIPC. [Photo provided to chinadaily.com.cn]

Anhui Easpeed Technology Co Ltd provided technical support for the event, demonstrating its medium-free aerial imaging technology. According to representative Kan Jiawei, the system, which uses a negative-refraction flat lens and self-developed infrared sensors to achieve precise touchless control, has already been adopted by several top-tier hospitals nationwide.

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